
A novel approach is described for the quantitation of three additives typically used in copper plating using a dual LC system with an ECD and a CAD.

A novel approach is described for the quantitation of three additives typically used in copper plating using a dual LC system with an ECD and a CAD.

Surfactants present a real challenge to the analytical chemist as they are a very complex class of chemical compounds.

Published: July 4th 2012 | Updated: