Quantitation and Characterization of Copper Plating Bath Additives by Liquid Chromatography with Charged Aerosol Detection and Electrochemical Detection
A novel approach is described for the quantitation of three additives typically used in copper plating using a dual LC system with an ECD and a CAD.
An Easy Way to a Fast Universal Method for Surfactant Analysis
Surfactants present a real challenge to the analytical chemist as they are a very complex class of chemical compounds.